I mean... if i had to guess, $LPK did claim "80% of customers among major global players have selected LPKF equipment".
Kinda clear glass substrates is the next packaging shift!
From est. timelines, major players like Absolics is ramping H2 2026, Samsung Electro Mechanics 2027 + their partners.
Then there's major shifts like TSM CoPoS 2028 (seems possible $LPK upstream exposure, unconfirmed).
Just that claim of 80% is staggering and my personal expectation was markets might price it in eventually as they volume ramp (disclosure, own LPK).
Don't think there needs to be any major news, probably just getting closer to HVM timelines.
Test test: @aleabitoreddit $lpk is ripping!!!! I didn’t see any big news other than sdax inclusion and some potential institutional ownership
The author is bullish on LPK, highlighting the company's claim that 80% of major global players have selected its equipment for glass substrate packaging. The author views glass substrates as the next major shift in packaging and expects the market to price in LPK's potential as high-volume manufacturing (HVM) timelines approach for industry players like Absolics and Samsung Electro Mechanics. The author notes the recent stock surge, attributing it to nearing HVM timelines and potential institutional ownership, which aligns with external news reporting a 16% surge driven by a prominent investor's buy order.
The author is explicitly bullish, disclosing a long position and citing LPK's dominant 80% market share claim in the emerging glass substrate equipment market. The author expects the stock to appreciate as the industry approaches high-volume manufacturing timelines. This bullish fundamental view aligns with the recent 16% price surge noted in external news, though the author attributes the momentum to broader industry timelines and institutional ownership rather than the specific influencer buy order mentioned in the news.
关键要点
LPK claims that 80% of major global players have selected its equipment for glass substrate packaging.
Glass substrates are anticipated to be the next significant shift in semiconductor packaging.
High-volume manufacturing (HVM) is projected to ramp up starting in 2026 for major players like Absolics, followed by Samsung Electro Mechanics in 2027.
The author holds a long position in LPK and believes the recent price action is a result of the market pricing in approaching HVM timelines and SDAX inclusion.
